Circuit device, circuit module, and method for manufacturing circuit device

摘要

A second conductive pattern 14 is provided on the upper surface of a circuit device 10. A second conductive pattern 14 is provided on the upper surface of an insulating resin 13 which seals a built-in first circuit element 12, etc., and a first conductive pattern 11 and the second conductive pattern 14 are electrically connected via connection means 15. Second circuit elements 22 are mounted on the second conductive pattern 14. Thus, circuit elements can be three-dimensionally mounted. Furthermore, since the circuit device 10 eliminates the need for a mounting substrate, a low-profile circuit device is provided.