发明名称 Vacuum treatment method and vacuum treatment device
摘要 A vacuum treatment method, which controls work to a target temperature and applies a vacuum treatment thereto, comprising the steps of placing work on a temperature-adjustable table in a vacuum treatment chamber, and feeding thermal conductivity gas into between the table and the work to impart thermal conductivity. The gas feeding step comprises the steps of individually discharging thermal conductivity gases from the respective gas sources of at least two thermal conductivity gases of different thermal conductivities at predetermined flow rates, individually detecting the pressures of the thermal conductivity gases, and individually controlling the thermal conductivity gas feed flow rates on the basis of the detected pressures.
申请公布号 US2004123805(A1) 申请公布日期 2004.07.01
申请号 US20030475857 申请日期 2003.11.03
申请人 TOMOYOSHI RIKI 发明人 TOMOYOSHI RIKI
分类号 B01J3/00;B01J3/02;C23C16/46;H01L21/00;H01L21/302;H01L21/3065;H01L21/31;H01L21/683;H01L21/687;(IPC1-7):C23F1/00;C23C16/00 主分类号 B01J3/00
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