发明名称 |
Method and apparatus for controlling CMP pad surface finish |
摘要 |
A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member having a smooth surface, pressing the pre-conditioning member against the polishing pad while moving the polishing pad, and flattening the surface of the polishing pad until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.
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申请公布号 |
US2004127144(A1) |
申请公布日期 |
2004.07.01 |
申请号 |
US20030678727 |
申请日期 |
2003.10.03 |
申请人 |
LAM RES CORP |
发明人 |
JENSEN ALAN J;STELLA MARIO;ZHAO EUGENE;RENTELN PETER;FARBER JEFFREY |
分类号 |
B24B21/04;B24B37/04;B24B49/04;B24B53/007;(IPC1-7):B24B49/00;B24B51/00 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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