THERMOPLASTIC POLYIMIDE RESIN FILM, MULTILAYER BODY AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD COMPOSED OF SAME

摘要

A multilayer body having a two-layer or three-layer structure in which a thermoplastic polyimide layer is formed on one or both sides of a non-thermoplastic polyimide film and the surface of the thermoplastic polyimide layer is subjected to a surface treatment is disclosed. A multilayer body comprising a polymer film and a polyimide resin composition layer which is formed on one or both sides of the polymer film and contains a polyimide resin having a specific structure and a thermosetting component is also disclosed. A resin film at least one side of which has such a surface profile that the arithmetical mean roughness (Ra1) measured at a cut-off of 0.002 mm is 0.05-1 mum and the ratio of Ra1 to the roughness (Ra2) measured at a cut-off of 0.1mm (Ra1/Ra2) is 0.4-1 and a multilayer body composed of such a resin film are further disclosed. By using these multilayer bodies, a printed wiring board which is excellent in adhesiveness and enables formation of a very small wiring circuit can be obtained.