CUTTING APPARATUS FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A cutting apparatus for a semiconductor package is provided to prevent a trimming apparatus from being stopped by a repetition rate of a trim/form unit, by preventing a singulation mold from being loaded while the singulation mold is not fully loaded, by reducing a time interval of transferring a transfer unit and by decreasing the number of times that a semiconductor package is stacked in a tray. CONSTITUTION: A trip/form unit trims/forms a lead of a leadframe of a strip type. The leadframe trimmed/formed from the trim/form unit is positioned in the singulation mold by a singulation unit that forms a singulated semiconductor package. An align unit(21) aligns the singulated semiconductor package so that the singulated semiconductor package can be stacked. A semiconductor package transfer unit(22) transfers the semiconductor packages aligned by the align unit to a semiconductor package stack unit(23). The number of the singulated semiconductor packages capable of being loaded in the longitudinal direction of the align unit and the semiconductor package transfer unit is a multiple of the number of the singulated semiconductor packages in the longitudinal direction that are loaded into the singulated mold in one loading process. The number of the singulated semiconductor packages capable of being loaded in the longitudinal direction of the align unit and the semiconductor package transfer unit is the same as the number of the singulated semiconductor package that can be maximumly loaded in the longitudinal direction of the cross section of the semiconductor package stack unit.