发明名称 Method and apparatus for monitoring a material processing system
摘要 The present invention presents an improved apparatus and method for monitoring a material processing system, wherein the material processing system includes a processing tool, a number of RF-responsive electrical sensors coupled to the processing tool to generate and transmit electrical data, and a sensor interface assembly (SIA) configured to receive the electrical data from the plurality of RF-responsive electrical sensors.
申请公布号 US2004126906(A1) 申请公布日期 2004.07.01
申请号 US20020331332 申请日期 2002.12.31
申请人 TOKYO ELECTRON LIMITED 发明人 KLEKOTKA JAMES E.
分类号 H01L21/00;(IPC1-7):H01L21/00 主分类号 H01L21/00
代理机构 代理人
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