| 摘要 |
A modular housing structure, comprising: a top casing; a bottom casing, assembled with the top casing, wherein at least a first circuit board is interposed between the top casing and the bottom casing; and a thickening set interposed between the top casing and the bottom casing and assembled with the top casing and the bottom casing via a plurality of fixing elements so as to accommodate other members such that an electronic device having the housing structure meets at least two specifications.
|
