发明名称 Cooling device and apparatus and method for making the same
摘要 A cooling device (10) for heat dissipation for a heat-generating component includes a heat sink (14) and a heat pipe (13). The heat sink attached to the component includes a base (11) and a plurality of fins (12) extending from the base. A bottom portion of the heat pipe formed between the base and the fins, the remainder of the heat pipe formed through the fins. An apparatus for making the cooling device includes a mold (20) and a core (30) accommodated in the mold. The mold includes a base part (21) and a pair of symmetrical forming parts (22) slidably engaged on the base part. The forming parts defines a plurality of slots (222), a cavity (224), and a recess (225) respectively corresponding to the fins of the heat sink, the base of the heat sink, and the heat pipe.
申请公布号 US2004125525(A1) 申请公布日期 2004.07.01
申请号 US20030660306 申请日期 2003.09.10
申请人 LIU HEBEN 发明人 LIU HEBEN
分类号 H01L23/427;(IPC1-7):H02H5/04 主分类号 H01L23/427
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