SEMICONDUCTOR CHIP PACKAGE WITH INDEX GROOVE

摘要

PURPOSE: A semiconductor chip package with an index groove is provided to easily mount a substrate by forming an index groove indicating a mounting direction in such a way that a leadframe is exposed. CONSTITUTION: A semiconductor chip is mounted on the leadframe(11) and is encapsulated by a package body(15). The semiconductor chip package(10) includes a lead(13) exposed to the outside of the package body, having an index pin indication(19) on the outer circumferential surface of the package body such that the index pin indication indicates a mounting direction according to the pin function of the lead. The index groove(21) that exposes a predetermined portion of the leadframe from the outer circumferential surface of the package body is formed in the package body.