| 摘要 |
PURPOSE: An earphone jack module of a mobile phone is provided to accomplish a compact mobile phone by installing a module of an earphone jack case at a hinge space. CONSTITUTION: An upper surface of a module case(90) is supported by three ribs(60c,60d,60e), and a hook(92) at the side of a module is caught by ribs(60d) formed at both sides of a hinge case(60a). A PCB substrate is installed to contact from a lower surface of the module case(90), so that terminals(91) of the module can physically and electrically contact with terminals of the PCB substrate. Accordingly, the hook(92) cannot be moved by being caught by an end of the rib(60e) at the front side of the module case(90), and the rear of the module case(90) is caught by an end of the hinge case(60a) at the rear side of the module case(90). In addition, the two side hooks cannot be released by being caught by the ribs(60d) at the lower portion of the module case(90).
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