发明名称 Polishing composition
摘要 A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, or a salt thereof; a polishing composition for a substrate for a precision part, containing the microwaviness reducing agent, an abrasive and water; a polishing composition comprising water, an abrasive, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, and wherein the surfactant has two or more ionic hydrophilic groups in its molecule and has a molecular weight of 300 or more; a method of reducing microwaviness of a substrate for a precision part; and a method for manufacturing a substrate for a precision part.
申请公布号 US2004123527(A1) 申请公布日期 2004.07.01
申请号 US20030737841 申请日期 2003.12.18
申请人 KITAYAMA HIROAKI;FUJII SHIGEO 发明人 KITAYAMA HIROAKI;FUJII SHIGEO
分类号 C09G1/02;C09K3/14;(IPC1-7):C09K3/14 主分类号 C09G1/02
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