发明名称 Thermal interface material
摘要 A thermal interface material (40) includes a polymer matrix and a number of carbon nanocapsules incorporated in the polymer matrix. The thermal interface material is sandwiched between a heat source (30) having a high density and a heat sink (50). The thermal interface material can provide a maximum surface contact area and can increase thermal conductivity between the heat source and the heat sink.
申请公布号 US2004125565(A1) 申请公布日期 2004.07.01
申请号 US20030648594 申请日期 2003.08.25
申请人 CHEN GA-LANE;LEU CHARLES 发明人 CHEN GA-LANE;LEU CHARLES
分类号 H01L23/373;(IPC1-7):H05K7/20 主分类号 H01L23/373
代理机构 代理人
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