Semiconductor device package with leadframe-to-plastic lock

摘要

Methods for manufacturing a semiconductor device package (10) with a leadframe (14) to plastic (12) mold lock are disclosed along with the associated package (10). A method of the invention discloses manufacturing a packaged semiconductor device (10) using steps for forming a leadframe (14) with at least one borehole (20). The borehole (20) region of the leadframe (14) is coined such that a lip (34) is formed at the junction of the borehole (20) and a leadframe (14) surface. Encapsulating the lip (34) with mold compound (12) forms a leadframe (14) to plastic (12) lock incorporated in the completed semiconductor device package (10).