发明名称 Sealed and pressurized liquid cooling system for microprocessor
摘要 According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.
申请公布号 US2004125561(A1) 申请公布日期 2004.07.01
申请号 US20020330915 申请日期 2002.12.27
申请人 GWIN PAUL J;KONSTAD ROLF A;DAVISON PETER A;TRAUTMAN MARK A 发明人 GWIN PAUL J;KONSTAD ROLF A;DAVISON PETER A;TRAUTMAN MARK A
分类号 G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
代理机构 代理人
主权项
地址