| 摘要 |
<p>The invention relates to a process for forming a composite by bonding a metal component to the surface of a cycloolefin resin molding, particularly, a process for forming a composite composed of a metal component and a cycloolefin resin molding which has extremely low permittivity and dielectric loss and extremely small water absorption and is optimum as a component of a processing device for high-frequency electric signals of GHz band, which process comprises heat- or pressure-bonding a metal component surface-treated with a triazinedithiol compound represented by the general formula (1) to the surface of a molding of a cycloolefin resin or a composition thereof: (1) wherein R is -OR', -SR', -NHR', or -N(R')2; R' is hydrogen, C1-10 alkyl, alkenyl, phenyl, phenylalkyl, alkylphenyl, or cycloalkyl; and M is H, Na, Li, K, 1/2Ca, 1/2Ba, an aliphatic primary, secondary, or tertiary amine, or a quaternary ammonium salt.</p> |
