METHOD FOR FORMING RESIN FILM AND METHOD FOR MANUFACTURING ELECTRONIC PARTS

摘要

A method for manufacturing a resin film according to the present invention includes depositing the resin material by heating a resin material at a heating temperature higher than a melting point of the resin material in a reduced pressure atmosphere. The resin material may have a viscosity-average molecular weight ranging from 500 to 1000000. Furthermore, a method for manufacturing an electronic component according to the present invention uses this method for manufacturing the resin film. In accordance with the present invention, a thin resin film can be manufactured with excellent controllability, so that an electronic component including such a resin film can be obtained. <IMAGE>