Method for manufacturing circuit board and circuit board and power conversion module using the same

摘要

A method for manufacturing a circuit board with high thermal dissipation includes the following steps: preparing a thermal conductive resin (21) composition including 70 to 95 mass% of an inorganic filler and 5 to 30 mass% of a resin composition that includes a liquid thermosetting resin, a thermoplastic resin powder, and a latent curing agent; bonding the thermal conductive resin composition (21) and a metal foil (22) together by heating at a temperature lower than a temperature at which the thermosetting resin starts to cure while applying pressure so that the thermal conductive resin composition (21) increases in viscosity and thus is solidified irreversibly; providing holes (25) and curing the thermosetting resin to form an insulating substrate (26); and forming a circuit pattern (27). This method can achieve improved productivity and low cost in processing the holes (25). It is preferable that the thermal conductive resin composition (21) is integral with a reinforcing material.