发明名称 |
Thermally-formable and cross-linkable precursor of a thermally conductive material |
摘要 |
The invention relates to a thermally-formable and cross-linkable precursor of a thermally-conductive material comprising a) one or more crosslinkable polymers where the melt flow index of the polymer or mixture of polymers (measured at 190 DEG C according to ASTM D-1238), respectively, is 10-100 g/10 min and b) one or more thermally-conductive fillers in an amount of at least 60 wt. % of the total weight of the precursor. <IMAGE>
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申请公布号 |
EP1433829(A1) |
申请公布日期 |
2004.06.30 |
申请号 |
EP20020028904 |
申请日期 |
2002.12.23 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
BOELZ, UWE;WEBER, PETER;REIMANN, STEFAN |
分类号 |
C08K3/00;C08K3/22;C08L23/26;C08L75/04;C09J7/02;H01L23/36;H01L23/373;H05K3/00;(IPC1-7):C09J7/02 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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