| 摘要 |
An electronic device (10) having a thermal control capability is disclosed. The electronic device includes a substrate (16), a signal conductive region (26) disposed on at least a portion of the substrate, the signal conductive region configured to provide a signal path, and a first semiconductor die (12) having an active surface (18) and a back surface (20). The back surface is configured with a plurality of bubbler cavities positioned to receive a cooling fluid (24). In addition, the first semiconductor die includes a first plurality of solder bumps (30) disposed on the active surface, the first plurality of solder bumps contiguous with, and electrically coupling the active surface to the signal conductive region. Further, an electrically reactive metal region (402) in communication with the signal conductive region is sized to provide a location for real-time iterative tuning of the electronic device. |
