| 摘要 |
AN APPARATUS AND METHOD ATTACHING A HEATSINK (214) TO A SURFACE OF AN ELECTRONIC PACKAGE (200, 300, 300, 500, 600) COMPRISING A SUBSTRATE (202), AN INTEGRATED CIRCUIT CHIP (204) ATTACHED TO THE SURFACE OF THE SUBSTRATE, AN ENCAPSULANT (206, 226, 306, 326, 406, 506, 606) ENCAPSULATING THE INTEGRATED CIRCUIT CHIP AND CONTACTING AT LEAST A PORTION OF THE SURFACE OF THE SUBSTRATE, AND AN ORIFICE (208, 308) FORMED IN THE TOP PORTION OF THE ENCAPSULANT TO ATTACH THE HEATSINK TO THE SURFACE OF THE ELECTRONIC PACKAGE. THE HEATSINK MAY BE ATTACHED AND REMOVED AS DESIRED TO ALLOW FOR PACKAGE IDENTIFICATION OR REWORK. |
