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发明名称
Passivative chemical mechanical polishing composition for copper film planarization
摘要
申请公布号
AU2003297590(A8)
申请公布日期
2004.06.30
申请号
AU20030297590
申请日期
2003.12.02
申请人
ADVANCED TECHNOLOGY MATERIALS, INC.
发明人
PETER WRSCHKA;MICHAEL DARSILLO;MACKENZIE KING;JUN LIU;DAVID BERNHARD;KARL BOGGS
分类号
C09G1/02;C23F3/00;H01L21/321;(IPC1-7):C09G1/02;C09G1/04
主分类号
C09G1/02
代理机构
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