| 摘要 |
A camera module for a mobile device is reduced in size and production cost. A lens (10) being essentially same in size as an image sensor chip (20) is bonded to a surface of the image sensor chip (20). An IR filter (30) is bonded to the lens and an iris material is provided onto the IR filter (31). Bump electrodes (25A, B) formed on a back surface of the image sensor chip (20) are connected to a printed circuit board. <IMAGE> |
