发明名称 |
Image sensor adapted for reduced component chip scale packaging |
摘要 |
The present invention discloses an image sensor die that has structures intended to more efficiently package the image sensor die. The structures include a spacer ring and stack bumps. The spacer ring serves to support a glass lid over the pixel array of the image sensor die. The stack bumps are raised in order to facilitate direct connection to flexible tape or a printed circuit board. <IMAGE> |
申请公布号 |
EP1434276(A2) |
申请公布日期 |
2004.06.30 |
申请号 |
EP20030256671 |
申请日期 |
2003.10.23 |
申请人 |
OMNIVISION INTERNATIONAL HOLDING LTD |
发明人 |
YAMAMOTO, KATSUMI |
分类号 |
H01L21/00;H01L23/00;H01L23/34;H01L27/14;H01L27/146;H01L31/0203 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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