| 摘要 |
PURPOSE: A method for manufacturing metal film by vacuum evaporation is provided to manufacture a metal film having thickness of tens of μm by coating a proper buffer layer for delamination using vacuum evaporation, thereby easily separating metal film layer from substrate. CONSTITUTION: The method comprises a step of vacuum evaporating a buffer layer(22) having thickness of 500 to 1,500 Å on the substrate as continuously maintaining a substrate(21) to an ordinary temperature; a step of evaporating a metal film layer(23) on an upper surface of the buffer layer to a metal evaporation ratio of 0.3 to 0.5 μm/min; a step of maintaining the substrate to a lower temperature after exposing the buffer layer and metal film layer formed substrate to the atmosphere; and a step of separating the buffer layer and the metal film layer from the substrate or separating the metal film layer from the buffer layer and the substrate, wherein the substrate is an aluminum plate on the surface of which an aluminum oxide film is formed, the metal film layer is evaporated by using gadolinium (Gd) or dysprosium (Dy) as a source, and the buffer layer is evaporated by using aluminum as a source, and wherein the substrate is a steel plate, the metal film layer is evaporated by using gadolinium (Gd) or dysprosium (Dy) as a source, and the buffer layer is evaporated by using chromium (Cr) as a source.
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