| 摘要 |
<p>System and method for formation of a hermetic seal (1106, 1107) with an significantly greater melting temperature than the melting temperature of the solder (1101) employed. The hermetic seal (1106, 1107) is formed from a solder (1101) with a low melting point and a metal (1102, 1105) having a predetermined thickness that corresponds to the solder (1101). The solder (1101) and metal (1102, 1105) combination undergoes reflow for a period of time relative to the solder (1101) thickness. The resultant seal (1106, 1107) has a melting point at a temperature significantly greater than the melting temperature of the solder (1101). <IMAGE></p> |
