| 摘要 |
An improved design for a high density thin film inductive write head assembly is provided. A pedestal and back flux closure of ferromagnetic material are formed on opposite ends of a planarized first pole piece. A plurality of coils of conductive material are deposited on top of the first pole piece between the pedestal and back flux closure. The coils comprise a plurality of loops or turns having voids between the coil loops. A photo resist material is deposited in the voids between the coils and the back flux closure, which is hard baked. A layer of alumina is deposited over the coils and hard baked photo resist material. The pedestal, back gap, coils, photo resist, and alumina are planarized by using a chemical mechanical polishing process. The thickness of the photo resist material relative to the coils is reduced using an O2 reactive ion etching process. A hard carbon or alumina filler is applied to fill the gaps between the coils and the photo resist. A CMP process is performed to planarize the carbon filler, coils, back flux closure and the pedestal.
|
