发明名称 |
Electronic device and its manufacturing method |
摘要 |
An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.
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申请公布号 |
US6756670(B1) |
申请公布日期 |
2004.06.29 |
申请号 |
US20000698055 |
申请日期 |
2000.10.30 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;TSUCHIYA MITSUNORI;URATA KAZUO;KOYAMA ITARU;IMATOU SHINJI;HAYASHI SHIGENORI;HIROSE NAOKI;SASAKI MARI;ISHIDA NORIYA;WADA KOUHEI |
分类号 |
H01L21/56;H01L23/29;H01L23/31;H01L23/495;(IPC1-7):H01L23/06 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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