发明名称 Dual band coupler
摘要 Disclosed is a dual band coupler, in which a dielectric layer having a coupling signal line is positioned between dielectric layers having a first main signal line and a second main signal line. Coupling coefficients of first and second signal lines can be independently controlled by laminating different numbers of dielectric layers between the coupling signal line and main signal lines, respectively. A shielding pattern for excluding mutual electromagnetic interference between the first and second main signal lines is formed on the dielectric layer having the coupling signal line to improve an isolation, and a small sized-dual band coupler can be provided because the dielectric layer having a ground pattern can be omitted.
申请公布号 US6756860(B2) 申请公布日期 2004.06.29
申请号 US20020212223 申请日期 2002.08.06
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SHIN JI HWAN
分类号 H03H7/48;H01P5/18;(IPC1-7):H01P3/08;H01P5/12 主分类号 H03H7/48
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