| 摘要 |
A conductive structure is disclosed. The conductive structure includes an interconnect and an adhesive layer including a bottom portion and an uppermost surface. The bottom portion is formed on the interconnect. The conductive structure also includes a first conductor, a dielectric and a second conductor. The first conductor has a thickness of less than six hundred Angstroms and includes a bottom portion and a side portion. The bottom portion of the first conductor is formed on the adhesive layer and the side portion extends above the uppermost surface of the adhesive layer. The dielectric has a lowermost surface formed on the bottom portion of the first conductor and another portion formed on the uppermost surface of the adhesive layer. The second conductor is formed on the dielectric.
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