发明名称 Plasma processing apparatus
摘要 A plasma processing apparatus has a vacuum vessel, a processing chamber arranged in the vacuum vessel and supplied with gas, a support electrode arranged in the processing chamber to support an object to be processed, a radio frequency providing unit for supplying a radio frequency in UHF or VHF band, and a magnetic field generating unit for generating a magnetic field in the processing chamber, wherein the radio frequency providing unit includes an antenna having a groove or step formed in its surface opposing the process object, whereby plasma of high density and high uniformity can be generated in a wide parameter region.
申请公布号 US6755935(B2) 申请公布日期 2004.06.29
申请号 US20010793443 申请日期 2001.02.27
申请人 HITACHI, LTD. 发明人 KAZUMI HIDEYUKI;SASAKI ICHIRO;MAEDA KENJI;TETSUKA TSUTOMU;KAWAHARA HIRONOBU
分类号 H05H1/46;B01J19/08;C23F4/00;H01J37/32;H01L21/302;H01L21/3065;(IPC1-7):H01L21/306 主分类号 H05H1/46
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