发明名称 |
Method for improving bump reliability for flip chip devices |
摘要 |
A new method is provided for the creation of a solder bump. Conventional methods are initially followed, creating a patterned layer of Under Bump Metal over the surface of a contact pad. A layer of photoresist is next deposited, this layer of photoresist is patterned and developed creating a resist mask having a T-shape opening aligned with the contact pad. This T-shaped opening is filled with a solder compound, creating a T-shaped layer of solder compound on the surface of the layer of UBM. The layer of photoresist is removed, exposing the Created T-shaped layer of solder compound, further exposing the layer of UBM. The layer of UBM is etched using the T-shaped layer of solder compound as a mask. Reflow of the solder compound results in creating a solder ball. |
申请公布号 |
US6756294(B1) |
申请公布日期 |
2004.06.29 |
申请号 |
US20020060483 |
申请日期 |
2002.01.30 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
CHEN YEN-MING;LIN CHIA-FU;HSU SHUN-LIANG;CHING KAI-MING;LEE HSIN-HUI;SU CHAO-YUAN;CHEN LI-CHIH |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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