发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR ENHANCING STATE OF INSULATING LAYER
摘要 PURPOSE: A method of manufacturing a semiconductor device is provided to improve the reliability by enhancing a state of an insulating layer between gate electrodes using multi-step insulating layer forming processes. CONSTITUTION: A plurality of gate electrodes(30) are formed on a semiconductor substrate(10) via a gate insulating layer(20). The first insulating layer(1) is formed along the upper surface of the resultant structure. The second insulating layer is formed on the first insulating layer. The other insulating layers are repeatedly formed on the entire surface of the resultant structure until a vacancy between the gate electrodes is completely filled.
申请公布号 KR20040055576(A) 申请公布日期 2004.06.26
申请号 KR20030087107 申请日期 2003.12.03
申请人 RENESAS TECHNOLOGY CORP. 发明人 MIYAGAWA YOSHIHIRO
分类号 H01L23/522;H01L21/31;H01L21/316;H01L21/768;H01L21/8234;H01L27/088;(IPC1-7):H01L21/31 主分类号 H01L23/522
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