发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR ENHANCING STATE OF INSULATING LAYER |
摘要 |
PURPOSE: A method of manufacturing a semiconductor device is provided to improve the reliability by enhancing a state of an insulating layer between gate electrodes using multi-step insulating layer forming processes. CONSTITUTION: A plurality of gate electrodes(30) are formed on a semiconductor substrate(10) via a gate insulating layer(20). The first insulating layer(1) is formed along the upper surface of the resultant structure. The second insulating layer is formed on the first insulating layer. The other insulating layers are repeatedly formed on the entire surface of the resultant structure until a vacancy between the gate electrodes is completely filled.
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申请公布号 |
KR20040055576(A) |
申请公布日期 |
2004.06.26 |
申请号 |
KR20030087107 |
申请日期 |
2003.12.03 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
MIYAGAWA YOSHIHIRO |
分类号 |
H01L23/522;H01L21/31;H01L21/316;H01L21/768;H01L21/8234;H01L27/088;(IPC1-7):H01L21/31 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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