METHOD FOR COMPRESSION BONDING USING UV LIGHT AND DEVICE THEREFOR

摘要

PURPOSE: A method for carrying out compression bonding between an element that is transparent to UV light and a substrate such as a silicon substrate is provided to improve the bonding strength between the element and the substrate without heating, thereby causing no thermal stress, by using UV light. CONSTITUTION: The method of bonding an element that is transparent to UV light to a substrate(110) comprises: forming an aluminum layer(112) on at least part of the one side of the substrate surface; arranging the element(120) that is transparent to UV light such as an optical element made of silica glass, onto the surface of the aluminum layer; and bonding the element to the aluminum layer by compressing the element toward the aluminum layer and irradiating UV ray to the bonding area, wherein the UV ray transmits the element. The device(130) for carrying out the method comprises: a holder(132); a compressing plate(134) for applying pressure to the element, being installed in the bottom part of the holder, wherein the compressing plate is made of a material being transparent to UV light; a UV lamp(136) installed inside the holder; a collimating lens(138) for collimating the UV ray emitted from the UV lamp as a parallel light, being installed inside the holder in a way to be positioned between the UV lamp and the compressing plate.