发明名称 METHOD FOR ENLARGING LIFE CYCLE OF MOLD COPPER PLATE FOR CONTINUOUS CASTING USING MOLD FLUX WHICH HAS LARGER THERMAL RESISTANCE
摘要 PURPOSE: A method for enlarging life cycle of mold copper plate for continuous casting using mold flux which has larger thermal resistance is provided to suppress cracking of the copper plate due to thermal strain by lowering heat transfer amount transferred to casting mold from molten steel in a part that is directly under meniscus. CONSTITUTION: The method is characterized in that the copper plate is prevented from being cracked by injecting a mold flux having fast crystallization rate into a continuous casting mold, thereby suppressing a surface temperature of the copper plate of a point that is 205 mm distanced underneath meniscus to 350 deg.C or less, wherein the mold flux comprises 30 to 50 wt.% of CaO, 25 to 40 wt.% of SiO2, 5 wt.% or less of Al2O3, 3 to 8 wt.% of MgO, 5 to 12 wt.% of Na2O and 5 to 10 wt.% of F, and wherein a ratio of Na2O/F is 1.2 to 3.0, a basicity of CaO/SiO2 is 1.1 to 1.7, and crystallizing initiation temperature is 1,150 deg.C or more.
申请公布号 KR20040054823(A) 申请公布日期 2004.06.26
申请号 KR20020081124 申请日期 2002.12.18
申请人 POSCO 发明人 CHO, JUNG UK;CHOI, HUI SEON;KIM, SEONG YEON
分类号 B22D11/16;(IPC1-7):B22D11/16 主分类号 B22D11/16
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