PCB INCLUDING OPTO-VIA HOLE AND PROCESSING PROCESS

摘要

PURPOSE: A PCB including an opto-via hole and a processing process are provided to connect stably signals without the damage of an optical waveguide which contacts directly to the outside. CONSTITUTION: A processing process comprises a step of processing a plurality of via holes on a plurality of CCL(copper clad laminates)(11,11') by using a drill, a step of coating an inner wall of the via holes, a step of forming a circuit pattern by exposing and etching the coated portion of an upper and lower surfaces at the CCL, a step of laminating the CCL where the circuit pattern is formed by using an insulation resin adhesion(13), and a step of processing an opto-via hole by removing the insulation resin adhesion at the inside of the via holes.