发明名称 FABRICATION METHOD OF ELECTROOPTIC SUBSTRATE, A FABRICATION METHOD OF AN ELECTROOPTIC DEVICE, AN ELECTROOPTIC DEVICE, PARTICULARLY IN RELATION TO APPLYING SILICON ON INSULATOR(SOI) TECHNOLOGY
摘要 PURPOSE: A fabrication method of an electrooptic substrate, a fabrication method of an electrooptic device, and an electrooptic device are provided to fabricate an electrooptic substrate with high throughput to obtain high reliability by forming shielding layers on a surface of the substrate through an application of SOI technology. CONSTITUTION: Shielding layers(211) are formed on a supporting substrate(210) in predetermined patterns. An insulator layer(212) is formed on the patterned shielding layers(211). Semiconductor layers(206) are formed on the insulator layer(212). Oxidize layers(226a) are formed by oxidizing a portion of the semiconductor layers(206). The oxidize layers(226a) are removed. A layer thickness of the oxidize layers(226a) is set to be smaller than that of the insulator layer(212).
申请公布号 KR20040055688(A) 申请公布日期 2004.06.26
申请号 KR20030093745 申请日期 2003.12.19
申请人 SEIKO EPSON CORPORATION 发明人 YASUKAWA MASAHIRO
分类号 G02F1/13;G02F1/136;G02F1/1362;H01L21/00;H01L21/84;H01L27/14;H01L31/00;H01L31/0216;(IPC1-7):G02F1/13 主分类号 G02F1/13
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