发明名称 |
FABRICATION METHOD OF ELECTROOPTIC SUBSTRATE, A FABRICATION METHOD OF AN ELECTROOPTIC DEVICE, AN ELECTROOPTIC DEVICE, PARTICULARLY IN RELATION TO APPLYING SILICON ON INSULATOR(SOI) TECHNOLOGY |
摘要 |
PURPOSE: A fabrication method of an electrooptic substrate, a fabrication method of an electrooptic device, and an electrooptic device are provided to fabricate an electrooptic substrate with high throughput to obtain high reliability by forming shielding layers on a surface of the substrate through an application of SOI technology. CONSTITUTION: Shielding layers(211) are formed on a supporting substrate(210) in predetermined patterns. An insulator layer(212) is formed on the patterned shielding layers(211). Semiconductor layers(206) are formed on the insulator layer(212). Oxidize layers(226a) are formed by oxidizing a portion of the semiconductor layers(206). The oxidize layers(226a) are removed. A layer thickness of the oxidize layers(226a) is set to be smaller than that of the insulator layer(212).
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申请公布号 |
KR20040055688(A) |
申请公布日期 |
2004.06.26 |
申请号 |
KR20030093745 |
申请日期 |
2003.12.19 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
YASUKAWA MASAHIRO |
分类号 |
G02F1/13;G02F1/136;G02F1/1362;H01L21/00;H01L21/84;H01L27/14;H01L31/00;H01L31/0216;(IPC1-7):G02F1/13 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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