CMP EQUIPMENT FOR SEMICONDUCTOR WAFER

摘要

PURPOSE: CMP(Chemical Mechanical Polishing) equipment for a semiconductor wafer is provided to improve the efficiency of a polishing pad and enhance the productivity of a polishing process by carrying out the polishing process on a plurality of semiconductor wafers using only one polishing pad. CONSTITUTION: CMP equipment(40) for a semiconductor wafer is provided with a head frame capable of being selectively located opposite to a polishing pad or a buffer, and a head(46) supported by the head frame for loading a plurality of semiconductor wafers opposite to the polishing pad and moving the plurality of semiconductor wafers up and down. The CMP equipment further includes a controller for controlling each part.