| 摘要 |
PURPOSE: A plating apparatus and method are provided to control easily and properly the minor constituents of plating solutions by using a minor constituent management unit. CONSTITUTION: A plating apparatus(10) includes a minor constituent management unit(3). The minor constituent management unit includes an analysis part and a minor constituent management controller. The analysis part is used for analyzing quantitatively the first additive for accelerating plating solutions, the second additive for retarding the plating solutions, and chlorine. The minor constituent management controller is used for controlling the minor constituent management unit. The analysis part includes an analysis cup, a plurality of reagent supply nozzles, a reference electrode, a silver-silver chloride electrode, a rotary electrode, and a counter electrode. The analysis cup stores the plating solutions. The plurality of reagent supply nozzles supply liquid reagents to the inside of the analysis cup. The reference electrode and the silver-silver chloride electrode are used for performing a titrimetry. The rotary electrode, the counter electrode and the reference electrode are used for performing a CVS or CPVS analysis. |
