发明名称 HIGH SPEED AND LOW POWER CONSUMPTION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A high speed and low power consumption semiconductor device and a manufacturing method thereof are provided to restrain the increase of parasitic capacitance between a gate electrode and a semiconductor substrate and improve electrical characteristics by forming a thin gate isolating layer and a thick insulating layer at the bottom and sidewall of a concavity of the semiconductor substrate. CONSTITUTION: A semiconductor device is provided with a semiconductor substrate(111) having a concavity, a gate electrode(135) protruded from the concavity to the upward direction, and an insulating layer(132) between the semiconductor substrate and the gate electrode. At this time, the insulating layer is made of the first and second insulating layer(131,129a).
申请公布号 KR20040054248(A) 申请公布日期 2004.06.25
申请号 KR20020081091 申请日期 2002.12.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JEONG DONG;KIM, SEONG HO;KIM, SEONG MIN;LEE, CHANG SEOP;LEE, SIN AE;PARK, DONG GEON
分类号 H01L21/28;H01L21/336;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/28
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