| 摘要 |
PURPOSE: A production method of electronic components and the electronic components are provided to prevent the corrosion because of the exposure of a cut face in a metal component or the dropout of a soldering plating. CONSTITUTION: Each metal components are cut and separated from a mold(10) by using the closing force when one pair of molds(10) is closed during a mold forming process of an electronic component. The mold comprises a lower mold(10A) and an upper mold(10B). The part of the metal component is transformed to a specific shape as occasion demands. The cut faces of each metal components or the part to be exfoliated on a soldering plating is covered by a forming resin material. Each metal components are sealed in the electronic component. Thereby, the corrosion is prevented. Therefore, the efficiency of the electronic component is improved.
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