| 摘要 |
PURPOSE: An electromagnetic wave shielding structure of a BGA(Ball Grid Array) package is provided to be capable of obtaining shielding effect and preventing the radiation of electromagnetic wave. CONSTITUTION: An electromagnetic wave shielding structure of a BGA package is provided with a semiconductor chip(60), a circuit board(52) for mounting the semiconductor chip, and metal plates(56,58) for releasing the heat generated from the circuit board and the semiconductor chip. At this time, the circuit board has an inner line connected with a wire(62). The electromagnetic wave shielding structure further includes a main circuit board(42) located at the lower portion of the circuit board for mounting the circuit board, and a grounding rod(70) connected with the circuit board and the metal plates and grounded through the main circuit board for forming an electromagnetic wave shield in order to prevent the radiation of the electromagnetic wave generated from the inner line and the semiconductor chip. |
