发明名称 |
ANISOTROPIC DRY ETCHING METHOD OF ZINC OXIDE SEMICONDUCTOR FOR PHOTO DEVICE USING BCl3 PLASMA GAS |
摘要 |
PURPOSE: An anisotropic dry etching method of zinc oxide semiconductor for a photo device using BCl3 plasma gas is provided to be capable of increasing etching rate, obtaining an uniform surface, and improving anisotropic etching characteristics. CONSTITUTION: A zinc oxide layer is deposited on a semiconductor substrate. The resultant structure is stably loaded on a susceptor in a reaction chamber. Predetermined plasma is generated by supplying BCl3-containing gas into the reaction chamber. Then, a dry etching process is carried out on the resultant structure by using the predetermined plasma. Preferably, the BCl3-containing gas further contains Cl2. Preferably, the BCl3-containing gas further contains Ar. Preferably, the dry etching process is carried out at the pressure of 1 mTorr to 1 Torr.
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申请公布号 |
KR20040054104(A) |
申请公布日期 |
2004.06.25 |
申请号 |
KR20020080780 |
申请日期 |
2002.12.17 |
申请人 |
GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
KIM, GYEONG GUK;KIM, HAN GI;SUNG, TAE YEON |
分类号 |
H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/3065 |
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