发明名称 MOLD ASSEMBLY OF INJECTION-MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mold assembly of an injection-molding device, which shortens the molding cycle of a product and minimizes a damage to a mold as much as possible. SOLUTION: This mold assembly is structured of a cavity plate, a fixed head die plate and a core-retainer plate connected together through a linkage means which transfers either of the fixed head die plate or the core-retainer plate with the cavity plate positioned at the center and consequently, makes the other transfer in the opposite direction by an interlocking action. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004174840(A) 申请公布日期 2004.06.24
申请号 JP20020342626 申请日期 2002.11.26
申请人 TAKAOKA SEIKO KK 发明人 HASHIMOTO NORITSUGU
分类号 B29C45/68;(IPC1-7):B29C45/68 主分类号 B29C45/68
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