| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly precise tool which is less prone to stick materials such as solder on the side of a material to be worked to the part with which the meterial to be worked comes into contact, manufactured easily and has high accuracy in a tool used to work an IC and an LSI package. SOLUTION: A diamond film the grain size of which is≤1μm and the thickness of which is 1-5μm is formed at least in the part where the material to be worked comes into contact with a base material of the tool for working the IC and the LSI package. The grain size is small, so the surface roughness Ra of the diamond film is reduced and highly accurate working is enabled, but polishing using a diamond paper, or the like is performed if necessary. It is preferable to set the hardness of the film on 8,000-10,000 by Hv. COPYRIGHT: (C)2004,JPO
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