INTEGRATED CIRCUIT AND METHODS OF MEASUREMENT AND PREPARATION OF MEASUREMENT STRUCTURE

摘要

A method for measuring an integrated circuit (IC) structure (12) by measuring an imprint (30) of the structure, a method for preparing a test site (26) for the above measuring, and IC (10) so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint (30) of the removed bottom surface of the structure in a top surface (32) of the substrate. The imprint can then be imaged using an atomic force microscope (AFM) (40). The image (50) can be used to measure the bottom surface of the structure.