发明名称 POLISHING LIQUID AND POLISHING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing liquid by which a metal for a wiring section is not corroded, a surface to be polished having flatness is obtained even when the surface to be polished is composed of a plurality of substances and a metallic residue and a polishing flaw after a polishing can be inhibited, and a method for a chemical-mechanical polishing by using the polishing liquid. <P>SOLUTION: The polishing liquid contains at least one kind selected from an aromatic sulfonic acid or an aromatic sulfonic acid salt, at least one kind selected from an aromatic carboxylic acid or an aromatic carboxylic acid salt and water, preferably comprises each of the aromatic sulfonic acid or the aromatic sulfonic acid salt and the aromatic carboxylic acid or the aromatic carboxylic acid salt of 0.001 to 5 wt.%, and each content ratio is set in 1:0.01 to 1:100. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004179294(A) 申请公布日期 2004.06.24
申请号 JP20020342094 申请日期 2002.11.26
申请人 HITACHI CHEM CO LTD 发明人 NARITA TAKENORI;MORISHIMA HIROYUKI;AMANOKURA HITOSHI;KIMURA TADAHIRO;SAKURADA TAKASHI;ANZAI SO;HANEHIRO MASANOBU;OMORI YOSHIKAZU
分类号 B24B37/00;C09K3/14;H01L21/304;H01L21/306;(IPC1-7):H01L21/304 主分类号 B24B37/00
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