| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which can be easily manufactured despite the fact that it is capable of coping sufficiently with a reduction in size. <P>SOLUTION: The wiring board 11 is equipped with a wiring board main body 12, a pad group, solder resists 21 and 22 and the like. The wiring board main body 12 is provided with a first main surface 13 and a second main surface 14. An electronic part mounting region 15 where an electronic part 16 is mounted is set up on the first main surface 13 of the wiring board main body 12. The pad group is arranged in the electronic part mounting region 15 and composed of a plurality of pads 23 connected to the electronic part 16. The solder resist 21 covering the first main surface 13 is provided with a recess 28 formed corresponding to the electronic part mounting region 15 so as to expose the pad group. An anisotropic conductive material layer 71 is formed in the recess 28 so as to cover the pad group. <P>COPYRIGHT: (C)2004,JPO</p> |
