| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a circuit board capable of being mounted with high-density onto a very small electronic apparatus by highly densifying a circuit pattern and shaping the circuit board itself into an optional shape. SOLUTION: In the first process, a high-density wiring electrode 12 is formed on a surface of a planar glass substrate 11 having a specular surface by a thin film technique. Borosilicate glass is used for the glass substrate 11. Aluminum is used for the wiring electrode 12, and the thickness of the wiring electrode 12 is approximately 1.5μ(Fig. A). In the second process, the glass substrate 11 which is being heated at temperatures of approximately 550°C in an electric furnace is placed on a V-shaped mold, and further an inverted V-shaped mold is placed on the glass substrate 11. The glass substrate 11 is pressurized with the mold's own weight and formed so as to be bent into an L-shape (Fig. B). In the third process, electronic parts 14 such as ICs are mounted on the glass substrate 11. Next, IC metal wire terminals or the like are connected to the wiring electrode 12 by ultrasonic heating welding or soldering (Fig. C). COPYRIGHT: (C)2004,JPO
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