SLURRY COMPOSITION FOR SECONDARY POLISHING OF SILICON WAFER

摘要

Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2 &tilde& 10 weight% of colloidal silica having an average particle size of 30 &tilde& 80 nm; 0.5 &tilde& 1.5 % by weight of ammonia; 0.2 &tilde& 1 weight% of a hydroxyalkylcellulose-based polymer for modifying rheology of the composition; 0.03 &tilde& 0.5 weight% of a polyoxyethylenealkylamine ether-based nonionic surfactant; 0.01 &tilde& 1 weight% of a quaternary ammonium base and the balance of deionized water.