发明名称 HIGH SPEED LOW DISSIPATION PCB TOPOLOGIES
摘要 A multilayer printed circuit board is provided, comprising a plurality of planar layers made of dielectric material, and a plurality of conductor traces secured with their rough surfaces to these dielectric material layers, their smooth surfaces looking outwards or facing each other in superposed laminar relation to form a coplanar structure, so that the skin effect losses in the circuit structure are reduced. The traces can be driven in parallel to form a single conductor line.
申请公布号 WO2004054332(A2) 申请公布日期 2004.06.24
申请号 WO2003RU00529 申请日期 2003.11.27
申请人 ABROSIMOV, IGOR ANATOLIEVICH 发明人 ABROSIMOV, IGOR ANATOLIEVICH
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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